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US Patent 11469553 High speed connector

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Contents

Is a
Patent
Patent

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11469553
Date of Patent
October 11, 2022
Patent Application Number
17158214
Date Filed
January 26, 2021
Patent Citations
‌
US Patent 10096921 Electrical connector having ribbed ground plate
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US Patent 10305224 Controlled impedance edged coupled connectors
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US Patent 10348040 High speed, high density electrical connector with shielded signal paths
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US Patent 10355416 Electrical connector with insertion loss control window in a contact module
‌
US Patent 10381767 High performance cable connector
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US Patent 10431936 Electrical connector with impedance control members at mating interface
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US Patent 10446983 Connector having a grounding member
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US Patent 10511128 Connector configurable for high performance
...
Patent Citations Received
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US Patent D997880 Electrical power connector
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US Patent 11757224 High performance cable connector
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US Patent 11942716 High speed electrical connector
0
0
Patent Primary Examiner
‌
Khiem M Nguyen
CPC Code
‌
H01R 13/6477
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H01R 13/518
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H01R 13/6594
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H01R 12/716
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H01R 12/724
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H01R 12/737
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H01R 13/502

Electrical connectors for very high speed signals, including signals at or above 112 Gbps. Effectiveness of shielding along the signal paths through the mating electrical connectors may be enhanced through the use of one or more techniques, including enabling two-sided shielding, connections between shield members and between shield members and grounded structures of printed circuit boards to which the connectors are mounted, and selective positioning of lossy material. Such techniques may be simply and reliably implemented in high density connector using one or more techniques. An electrical connector may include core members held by a housing together with leadframe assemblies attached to the core members. The core members may include features that would be difficult to mold in a housing and may include both shields and lossy materials in locations that would be difficult to incorporate in a leadframe assembly.

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