US Patent 11469521 Three dimensional antenna array module

Provided is an apparatus including a plurality of antenna modules and a printed circuit board (PCB) having a plurality of holes embedded with a heat sink. Each antenna module includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells mounted on a first surface of the antenna substrate, and a plurality of packaged circuitry mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.