Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
October 11, 2022
Patent Application Number
16488456
Date Filed
February 20, 2018
Patent Primary Examiner
A microneedle device of the present invention comprises a substrate, microneedles disposed on the substrate, and a coating layer formed on the microneedles, wherein a length of the microneedles is 300 to 500 μm, the microneedles are disposed on the substrate at a density of 28 to 80 needles/cm
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