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US Patent 11446407 Adhesive-containing wound closure device and method

Patent 11446407 was granted and assigned to Ethicon, Inc. on September, 2022 by the United States Patent and Trademark Office.

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Patent Applicant

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Current Assignee

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Glenn Hoskin0

Julian Quintero0

Jerry Y. Jonn0

Date of Patent

September 20, 2022

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Patent Application Number

165564710

Date Filed

August 30, 2019

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Patent Citations

US Patent 10470935 Skin closure systems and devices of improved flexibility and stretchability for bendable joints

US Patent 10434211 Adhesive-containing wound closure device and method

Patent Primary Examiner

Alexander J Orkin

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An article, such as a tissue bonding article, includes a flexible material, a polymerization initiator or rate modifier disposed in or on the flexible material, and a polymerizable adhesive composition permeated throughout at least a portion of the flexible material, where the polymerization initiator or rate modifier is a polymerization initiator or rate modifier for the polymerizable adhesive composition.

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