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US Patent 11437396 Semiconductor device

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
Date Filed
September 25, 2020
Date of Patent
September 6, 2022
Patent Application Number
17032128
Patent Citations
‌
US Patent 10319729 Methods and apparatuses with vertical strings of memory cells and support circuitry
‌
US Patent 10651197 3D semiconductor devices including a supporter and methods of forming the same
‌
US Patent 10032787 Three-dimensional semiconductor memory device
‌
US Patent 10115667 Semiconductor device with an interconnection structure having interconnections with an interconnection density that decreases moving away from a cell semiconductor pattern
Patent Citations Received
‌
US Patent 12069861 Memory device with reduced bending stack
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11437396
Patent Primary Examiner
‌
Allison Bernstein
CPC Code
‌
H01L 27/11573
‌
H01L 27/11582
‌
H01L 27/11565
‌
H01L 27/11563
‌
H01L 27/11578
‌
H01L 27/1157
‌
H01L 29/66833
‌
H01L 29/792
‌
H01L 27/11575
‌
H01L 27/11568

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