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US Patent 11437348 Microelectronic assemblies with communication networks

Overview Structured Data Issues Contributors Activity

Is a

Current Assignee

Date Filed

December 21, 2020

Date of Patent

September 6, 2022

Patent Applicant

Patent Application Number

17128558

Patent Citations

US Patent 10826492 Power gating in stacked die structures

US Patent 10535608 Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrate

US Patent 11133256 Embedded bridge substrate having an integral device

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Primary Examiner

Nicholas J Tobergte

CPC Code

H01L 2224/16225

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