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US Patent 11437274 Fully self-aligned via
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Patent
Current Assignee
Micromaterials, Inc
Date Filed
September 14, 2020
Date of Patent
September 6, 2022
Patent Applicant
Micromaterials, Inc
Patent Application Number
17019909
Patent Citations
US Patent 10553485 Methods of producing fully self-aligned vias and contacts
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11437274
Patent Primary Examiner
Dale E Page
CPC Code
H01L 21/76831
H01L 21/76843
H01L 21/76871
H01L 23/5226
H01L 23/53295
H01L 21/76808
H01L 21/76804
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