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US Patent 11437242 Selective removal of silicon-containing materials

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
Current Assignee
Applied Materials
Applied Materials
Date Filed
November 27, 2018
Date of Patent
September 6, 2022
Patent Applicant
Applied Materials
Applied Materials
Patent Application Number
16201724
Patent Citations
‌
US Patent 10062578 Methods for etch of metal and metal-oxide films
‌
US Patent 10062579 Selective SiN lateral recess
‌
US Patent 10062585 Oxygen compatible plasma source
‌
US Patent 10062587 Pedestal with multi-zone temperature control and multiple purge capabilities
‌
US Patent 10121689 Moment cancelling pad raising mechanism in wafer positioning pedestal for semiconductor processing
‌
US Patent 10083830 Substrate cleaning method for removing oxide film
‌
US Patent 10026621 SiN spacer profile patterning
‌
US Patent 10032606 Semiconductor processing with DC assisted RF power for improved control
‌
US Patent 10043674 Germanium etching systems and methods
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US Patent 10043684 Self-limiting atomic thermal etching systems and methods
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11437242
Patent Primary Examiner
‌
Stephanie P Duclair

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