Patent attributes
A radio communication module of the invention includes: a mounting substrate having a first surface and a second surface; an antenna substrate mounted on the first surface; and an IC package that is mounted on the second surface and includes an RFIC. The mounting substrate includes a heat-dissipation via hole penetrating through the mounting substrate and extending between the first surface and the second surface, a heat dissipation pattern formed on the first surface and is connected to the heat-dissipation via hole, and a non-heat-dissipation via hole transmitting an electrical signal or electrical current, which are formed on thereon. In a plan view when viewed from the thickness direction of the mounting substrate, the heat-dissipation via hole is connected to the RFIC at a position at which the heat-dissipation via hole overlaps with the RFIC, and the heat dissipation pattern extends to an outside of the antenna substrate.
