US Patent 11419789 Blister package lid

A blister package lid includes a substrate, a layer of adhesive, and a continuous pattern of electrically conductive wire disposed directly on the adhesive layer. The continuous pattern of wire has a plurality of detector segments, and the plurality of detector segments have respective destructible portions of wire at locations on the substrate corresponding to cavities of a blister sheet. Each detector segment has an outer connector portion and an inner connector portion. The outer connector portion and the inner connector portion of each detector segment are adjacent to one another, and pairs of successive first and second detector segments of the plurality of detector segments are connected by an arced segment between the inner connector portion of the first detector segment and the outer connector portion of the second detector segment.