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US Patent 11417629 Three-dimensional stacking structure and manufacturing method thereof

Patent 11417629 was granted and assigned to Taiwan Semiconductor Manufacturing Company on August, 2022 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
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Date Filed
February 11, 2020
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Date of Patent
August 16, 2022
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Patent Application Number
16787031
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Patent Citations
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US Patent 10354980 Three-dimensional memory device containing bonded chip assembly with through-substrate via structures and method of making the same
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US Patent 10510629 Integrated circuit package and method of forming same
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US Patent 11049834 Hybrid bonding using dummy bonding contacts
Patent Citations Received
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US Patent 12009296 Semiconductor device and manufacturing method thereof
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Patent Inventor Names
Chao-Wen Shih
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Tzuan-Horng Liu
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Sung-Feng Yeh
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Ming-Fa Chen
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11417629
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Patent Primary Examiner
Bradley Smith
Bradley Smith
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CPC Code
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H01L 2224/16145
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H01L 2224/80895
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H01L 2225/06541
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H01L 23/49827
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H01L 25/0657
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H01L 25/0652
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