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US Patent 11411041 Flexible substrate module and fabrication method

Patent 11411041 was granted and assigned to Carestream on August, 2022 by the United States Patent and Trademark Office.

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Is a
Patent
Patent
0

Patent attributes

Patent Applicant
Carestream
Carestream
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Current Assignee
Carestream
Carestream
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
114110410
Patent Inventor Names
Bradley S. Jadrich0
Ravi K. Mruthyunjaya0
Timothy J. Wojcik0
Date of Patent
August 9, 2022
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Patent Application Number
166034240
Date Filed
May 15, 2017
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Patent Primary Examiner
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Blake C Riddick
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CPC Code
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H01L 27/14687
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H01L 23/60
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H01L 31/03926
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H01L 31/1892
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H01L 27/14632
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H01L 27/14663
0

A digital radiographic image sensor includes a flexible first substrate with an image sensor array. A scintillator is formed over the array, and bonding pads in a peripheral region outside the array are connected to the array. A second substrate is attached to a bottom of the first substrate and includes a scribed or perforated break line to enable removal of a peripheral region of the second substrate.

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