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US Patent 11404299 Substrate transfer mechanism, substrate processing apparatus, and substrate processing method

Patent 11404299 was granted and assigned to Tokyo Electron on August, 2022 by the United States Patent and Trademark Office.

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Is a
Patent
Patent
0

Patent attributes

Patent Applicant
Tokyo Electron
Tokyo Electron
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Current Assignee
Tokyo Electron
Tokyo Electron
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
114042990
Patent Inventor Names
Shinji Wakabayashi0
Date of Patent
August 2, 2022
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Patent Application Number
165544330
Date Filed
August 28, 2019
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Patent Citations Received
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US Patent 12074042 High-density substrate processing systems and methods
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Patent Primary Examiner
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Saul Rodriguez
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CPC Code
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H01L 21/67742
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H01L 21/67754
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H01L 21/68707
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H01L 21/67745
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H01L 21/67196
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H01L 21/67201
0

In a substrate transfer mechanism, a moving body moves horizontally, and a support body is provided at the moving body to rotate about a vertical shaft. A first rotary shaft and a second rotary shaft are disposed vertically. A first arm forms a first substrate support region for supporting a first substrate, the first arm having a base portion connected to the first rotary shaft and a tip portion rotating at an outer side of the support body. A second arm forms a second substrate support region for supporting a second substrate, the second arm having a base portion connected to the second rotary shaft and a tip portion rotating the outer side of the support body. Further, an elevating mechanism is configured to raise and lower the second rotary shaft depending on a direction of the second arm with respect to the support body.

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