US Patent 11395413 Liquid metal fusion with conductive inks and pastes
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Patent Inventor Names
Anibal T. De Almeida0
Carmel Majidi0
Hugo Paisana0
Mahmoud Tavakoli0
Edits on 6 Apr, 2023
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Patent Jurisdiction
Patent Number
113954130
Date of Patent
July 19, 2022
0Patent Application Number
166470830
Date Filed
September 13, 2018
0Patent Primary Examiner
CPC Code
Edits on 20 Jul, 2022
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US Patent 11395413 Liquid metal fusion with conductive inks and pastes
Article
Coating inkjet-printed traces of silver nanoparticles (AgNP) ink with a thin layer of eutectic gallium indium (EGaIn) increases the electrical conductivity and significantly improves tolerance to tensile strain. This enhancement is achieved through a room temperature “sintering” process in which the liquid-phase EGaIn alloy binds the AgNP particles to form a continuous conductive trace. These mechanically robust thin-film circuits are well suited for transfer to highly curved and non-developable 3D surfaces as well as skin and other soft deformable substrates.
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Is a
Patent jurisdiction
Patent number
11395413
Date of patent
July 19, 2022
Patent application number
16647083
Date Filed
September 13, 2018
Patent primary examiner
CPC Code
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