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US Patent 11393807 Densely packed electronic systems

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Patent Citations Received
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US Patent 12136576 Microelectronic module
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 US Patent 11393807 Densely packed electronic systems

Article

A glass circuit assembly employing densely packed components is described. Air cooled computer systems employing densely packed circuit components are described. Relating to agile reconfigurable computer systems a high-resolution substrate having an area of at least 100 cm

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
11393807
Date of patent
July 19, 2022
Patent application number
17370737
Date Filed
July 8, 2021
Patent citations
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US Patent 10039210 Integrated thermal inserts and cold plate
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US Patent 10249503 Printed circuit board, semiconductor package and method of manufacturing the same
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US Patent 10336599 Cover for a water cooler reservoir bottle
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US Patent 10461009 3DIC packaging with hot spot thermal management features
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US Patent 10910364 3D semiconductor device
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US Patent 10966338 Densely packed electronic systems
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US Patent 11064626 Densely packed electronic systems
Patent primary examiner
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Courtney L Smith

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