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US Patent 11384446 Compositions and methods for the electrodeposition of nanotwinned copper

Patent 11384446 was granted and assigned to MacDermid on July, 2022 by the United States Patent and Trademark Office.

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A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.

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