Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Elie H. Najjar0
Thomas B. Richardson0
Kyle M. Whitten0
Jianwen Han0
Pingping Ye0
Stephan I. Braye0
Date of Patent
July 12, 2022
0Patent Application Number
170054070
Date Filed
August 28, 2020
0Patent Primary Examiner
A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.
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