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US Patent 11380821 Light emitting diode package structure
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Patent
Date Filed
September 28, 2020
Date of Patent
July 5, 2022
Patent Application Number
17034321
Patent Citations Received
US Patent 11702461 T-cell modulatory multimeric polypeptides comprising reduced-affinity immunomodulatory polypeptides
0
US Patent 11708400 T-cell modulatory multimeric polypeptides and methods of use thereof
0
US Patent 11767355 Methods for modulating an immune response
US Patent 11479595 Methods for modulating an immune response
US Patent 11505588 T-cell modulatory multimeric polypeptides and methods of use thereof
US Patent 11505591 T-cell modulatory multimeric polypeptides and methods of use thereof
US Patent 11530248 T-cell modulatory multimeric polypeptides and methods of use thereof
US Patent 11851471 T-cell modulatory multimeric polypeptides and methods of use thereof
0
US Patent 11851467 T-cell modulatory multimeric polypeptides and methods of use thereof
0
US Patent 11878062 Multimeric T-cell modulatory polypeptides and methods of use thereof
0
•••
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11380821
Patent Primary Examiner
Savitri Mulpuri
CPC Code
H01L 33/50
H01L 33/486
H01L 33/46
H01L 33/60
H01L 33/10
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