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US Patent 11373908 High efficiency die dicing and release

Patent 11373908 was granted and assigned to 3D Glass Solutions, Inc. on June, 2022 by the United States Patent and Trademark Office.

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Patent attributes

Patent Applicant

3D Glass Solutions, Inc.

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Current Assignee

3D Glass Solutions, Inc.

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Carrie F. Schmidt0

Jeb H. Flemming0

Sierra D. Jarrett0

Roger Cook0

Mark Popovich0

Luis C. Chenoweth0

Jeff Bullington0

Date of Patent

June 28, 2022

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Patent Application Number

176019970

Date Filed

April 16, 2020

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Patent Citations

US Patent 10070533 Photo-definable glass with integrated electronics and ground plane

US Patent 10201901 Robot apparatus, method for controlling robot, program, and recording medium

Patent Citations Received

US Patent 11908617 Broadband induction

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Patent Primary Examiner

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A method of batch massively parallel die release of a die from a substrate enabling low cost mass production of with passive, system in package (SiP) or system-in-a-package, or systems-on-chip (SoC), filters and/or other devices from a glass substrate.

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