US Patent 11366085 Integrated laser bond inspection and associated systems and methods

Disclosed herein is a system and method for inspecting a bonded structure in a component. The system includes an integrated probe and a processor coupled to the integrated probe. The integrated probe includes an ultrasonic component and a laser component. The ultrasonic component is configured to transmit pulsed sound waves into the bonded structure and receive reflected pulsed sound waves from the bonded structure. The laser component is configured to generate laser pulses and direct the laser pulses to the bonded structure to generate tension waves across the bonded structure. The processor is configured to test a bonded structure in the component. Further, the processor includes a pre-test module configured to operate the ultrasonic component in a pre-test mode, a test module configured to operate the laser component in a test mode, and a post-test module configured to operate the ultrasonic component in a post-test mode.