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US Patent 11361978 Gas delivery module

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Infobox
Patent Citations
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US Patent 10096516 Method of forming a barrier layer for through via applications
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Infobox
Is a
Patent
Patent
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Patent Applicant
Applied Materials
Applied Materials
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Current Assignee
Applied Materials
Applied Materials
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
113619780
Date of Patent
June 14, 2022
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Patent Application Number
169264220
Date Filed
July 10, 2020
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Patent Citations
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US Patent 11101174 Gap fill deposition process
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US Patent 10049927 Seam-healing method upon supra-atmospheric process in diffusion promoting ambient
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US Patent 10083834 Methods of forming self-aligned vias
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US Patent 10096516 Method of forming a barrier layer for through via applications
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US Patent 10179941 Gas delivery system for high pressure processing chamber
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US Patent 10224224 High pressure wafer processing systems and related methods
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US Patent 10234630 Method for creating a high refractive index wave guide
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US Patent 10269571 Methods for fabricating nanowire for semiconductor applications
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US Patent 10276411 High pressure and high temperature anneal chamber
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US Patent 10403729 Semiconductor devices and contact plugs
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US Patent 10410918 Enhanced cobalt agglomeration resistance and gap-fill performance by ruthenium doping
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US Patent 10529585 Dry stripping of boron carbide hardmask
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US Patent 10529603 High pressure wafer processing systems and related methods
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US Patent 10566188 Method to improve film stability
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US Patent 10622214 Tungsten defluorination by high pressure treatment
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US Patent 10636669 Seam healing using high pressure anneal
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US Patent 10636677 High pressure and high temperature anneal chamber
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US Patent 10636704 Seam-healing method upon supra-atmospheric process in diffusion promoting ambient
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US Patent 10643867 Annealing system and method
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US Patent 10675581 Gas abatement apparatus
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US Patent 10685830 Condenser system for high pressure processing system
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US Patent 10714331 Method to fabricate thermally stable low K-FinFET spacer
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US Patent 10720341 Gas delivery system for high pressure processing chamber
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US Patent 10748783 Gas delivery module
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US Patent 10790183 Selective oxidation for 3D device isolation
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US Patent 10847360 High pressure treatment of silicon nitride film
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US Patent 10854483 High pressure steam anneal processing apparatus
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US Patent 10916433 Methods of forming metal silicide layers and metal silicide layers formed therefrom
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US Patent 10950429 Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom
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US Patent 10957533 Methods for etching a structure for semiconductor applications
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US Patent 11018032 High pressure and high temperature anneal chamber
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Patent Primary Examiner
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Nikolay K Yushin
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CPC Code
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C23C 16/452
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H01L 21/67011
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H01L 21/6719
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H01L 21/67126
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H01L 21/67017
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H01L 21/447
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