US Patent 11359047 Epoxy resin systems
Patent 11359047 was granted and assigned to Hexion Inc. on June, 2022 by the United States Patent and Trademark Office.
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Patent Inventor Names
Alla Hale0
Amitabh Bansal0
Diana Sepulveda-Camarena0
Jennifer W. Chung0
Larry Steven Corley0
Leeanne Taylor0
Edits on 16 Jun, 2022
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US Patent 11359047 Epoxy resin systems
Article
Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylphosphonate, and combinations thereof, and a second curing agent.
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Patent applicant
Current assignee
Patent jurisdiction
Patent number
11359047
Date of patent
June 14, 2022
Patent application number
16126612
Date Filed
September 10, 2018
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