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US Patent 11346963 Bonding materials of dissimilar coefficients of thermal expansion
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Patent
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Date Filed
November 21, 2019
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Date of Patent
May 31, 2022
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Patent Application Number
16690770
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Patent Citations
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•••
Patent Inventor Names
Yurun Liu
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Peiyan Cao
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11346963
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Patent Primary Examiner
Chih-Cheng Kao
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CPC Code
G01T 1/247
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G01T 1/244
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G03B 42/02
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A61B 6/4241
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G01T 1/20188
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G01T 1/246
0
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