US Patent 11335045 Combining feature maps in an artificial intelligence semiconductor solution

In some embodiments, a system includes an artificial intelligence (AI) chip and a processor coupled to the AI chip and configured to receive an input image, crop the input image into a plurality of cropped images, and execute the AI chip to produce a plurality of feature maps based on at least a subset of the plurality of cropped images. The system may further merge at least a subset of the plurality of feature maps to form a merged feature map, and produce an output image based on the merged feature map. The cropping and merging operations may be performed according to a same pattern. The system may also include a training network configured to train weights of the CNN model in the AI chip in a gradient descent network. Cropping and merging may be performed over the training sample images in the training work in a similar manner.