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US Patent 11318663 Multi-layer stamp

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
1
Date Filed
December 17, 2020
1
Date of Patent
May 3, 2022
1
Patent Application Number
17125037
1
Patent Citations
‌
US Patent 10252514 Apparatus and methods for micro-transfer-printing
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US Patent 10189243 Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion
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US Patent 10181483 Laser assisted transfer welding process
Patent Inventor Names
Tanya Yvette Moore
1
David Gomez
1
Ronald S. Cok
1
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
11318663
1
Patent Primary Examiner
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Joseph S Del Sole
1
CPC Code
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B29C 33/3842
1

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