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US Patent 11315747 On-chip micro electron source and manufacturing method thereof

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Edits on 4 Apr, 2023
"Entity importer update"
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Golden AI
edited on 4 Apr, 2023
Infobox
Is a
Patent
Patent
1
Patent Applicant
Peking University
Peking University
1
Current Assignee
Peking University
Peking University
1
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
113157471
Date of Patent
April 26, 2022
1
Patent Application Number
172928621
Date Filed
November 7, 2019
1
Patent Primary Examiner
‌
Christopher M Raabe
1
CPC Code
‌
H01J 9/18
1
‌
H01J 3/026
1
Edits on 26 Sep, 2022
"Entity importer update"
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Golden AI
edited on 26 Sep, 2022
Infobox
Is a
Patent
Patent
1
Patent Applicant
Peking University
Peking University
1
Current Assignee
Peking University
Peking University
1
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
113157471
Date of Patent
April 26, 2022
1
Patent Application Number
172928621
Date Filed
November 7, 2019
1
Patent Primary Examiner
‌
Christopher M Raabe
1
CPC Code
‌
H01J 9/18
1
‌
H01J 3/026
1
Edits on 19 May, 2022
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created this topic on 19 May, 2022
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Infobox (+11 properties)
Article (+954 characters)
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 US Patent 11315747 On-chip micro electron source and manufacturing method thereof

Article

Provided are an on-chip miniature electron source and a method for manufacturing the same. The on-chip miniature electron source includes: a thermal conductive layer; an insulating layer provided on the thermal conductive layer, where the insulating layer is made of a resistive-switching material, and at least one through hole is provided in the insulating layer; and at least one electrode pair provided on the insulating layer, where at least one electrode of the electrode pair is in contact with and connected to the thermal conductive layer via the through hole, where there is a gap between two electrodes of the electrode pair, and a tunnel junction is formed within a region of the insulating layer under the gap. Thus, heat generated by the on-chip micro electron source can be dissipated through the electrode and the thermal conductive layer, thereby significantly improving heat dissipation ability of the on-chip miniature electron source.

Infobox
Is a
Patent
Patent
Patent applicant
Peking University
Peking University
Current assignee
Peking University
Peking University
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
11315747
Date of patent
April 26, 2022
Patent application number
17292862
Date Filed
November 7, 2019
Patent primary examiner
‌
Christopher M Raabe
CPC Code
‌
H01J 9/18
‌
H01J 3/026

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