US Patent 11304156 Physical layer aspects for hierarchical mobility
Patent 11304156 was granted and assigned to Qualcomm on April, 2022 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
December 17, 2019
0
Date of Patent
April 12, 2022
0
Patent Applicant
Patent Application Number
16717997
0
Patent Citations
Patent Inventor Names
Tingfang Ji
0
Hung Dinh Ly
0
Heechoon Lee
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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