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US Patent 11302545 System and method for controlling semiconductor manufacturing equipment

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Is a
Patent
Patent

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11302545
Date of Patent
April 12, 2022
Patent Application Number
16825889
Date Filed
March 20, 2020
Patent Citations
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US Patent 10997340 Pattern centric process control
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US Patent 10777470 Selective inclusion/exclusion of semiconductor chips in accelerated failure tests
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US Patent 10957031 Intelligent defect detection from image data
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US Patent 10012900 Method of correcting mask pattern and method of manufacturing reticle
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US Patent 10546085 Pattern centric process control
Patent Primary Examiner
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Crystal J Barnes-Bullock
CPC Code
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G03F 7/70441
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G03F 7/705
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G03F 7/70508
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G03F 7/70525
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G03F 7/70616
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G03F 7/70633
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G03F 7/70641
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G03F 7/7065
...

The present disclosure provides a system and a method for controlling semiconductor manufacturing equipment. The system includes a sensor, a sensor interface, and an analysis unit. The sensor provides a sensor signal. The sensor interface receives the sensor signal and generates an input signal for a database server. A front-end subsystem receives the input signal from the database server and performs a comparison process to generate a data signal. A calculation subsystem performs an artificial intelligence analytical process to generate an optimal parameter set and a simulated result map according to the data signal. A message and tuning subsystem generates an alert signal and a feedback signal according to the optimal parameter set and the simulated result map, and the message and tuning subsystem transmits the alert message to a user of the semiconductor manufacturing equipment.

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