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US Patent 11300740 Optical module package

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
March 27, 2021
Date of Patent
April 12, 2022
Patent Application Number
17214825
Patent Citations
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US Patent 10290619 Photonic integrated circuit package
0
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US Patent 10761262 Module with transmit and receive optical subassemblies with specific pic cooling architecture
0
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US Patent 10873399 Method and system for a photonic interposer
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US Patent 10996412 Electronic device comprising an electronic chip provided with an optical cable
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US Patent 10877217 Copackaging of asic and silicon photonics
0
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US Patent 11043478 Integrated circuit bridge for photonics and electrical chip integration
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US Patent 10012792 Three-dimensional integrated photonic structure with improved optical properties
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US Patent 10025047 Integration of silicon photonics IC for high data rate
0
Patent Inventor Names
Sahnggi Park
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11300740
Patent Primary Examiner
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Agustin Bello

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