Patent attributes
A radio frequency module includes: a module board including first and second principal surfaces on opposite sides of the module board; a semiconductor integrated circuit (IC) including third and fourth principal surfaces on opposite sides of the semiconductor IC; and an external-connection terminal disposed on the second principal surface. The third principal surface faces the second principal surface and is closer to the second principal surface than the fourth principal surface is to the second principal surface, and the semiconductor IC includes: at least one of (i) a power amplifier (PA) control circuit configured to control a radio frequency component using a control signal, (ii) a low noise amplifier configured to amplify a reception signal, or (iii) a switch; and a signal electrode disposed on the fourth principal surface, and via the signal electrode the semiconductor IC is configured to receive or output a radio frequency signal and/or the control signal.
