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US Patent 11284519 Electronic board comprising SMDS soldered on buried solder pads

Patent 11284519 was granted and assigned to Safran Electronics & Defense on March, 2022 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Patent Applicant

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Safran Electronics & Defense

Current Assignee

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Safran Electronics & Defense

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

112845190

Patent Inventor Names

Philippe Chocteau0

Denis Lecordier0

Date of Patent

March 22, 2022

Patent Application Number

166303640

Date Filed

July 13, 2018

Patent Citations

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US Patent 10039184 Circuit board structure and manufacturing method thereof

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US Patent 10306778 Printed circuit board with dam around cavity and manufacturing method thereof

Patent Primary Examiner

CPC Code

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The invention relates to a method for manufacturing (S) an electronic board (

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