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US Patent 11282760 Integrated packaging devices and methods with backside interconnections
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Patent
Current Assignee
Obsidian Sensors, Inc.
Date Filed
October 22, 2019
Date of Patent
March 22, 2022
Patent Applicant
Obsidian Sensors, Inc.
Patent Application Number
16660664
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11282760
Patent Primary Examiner
Fernando L Toledo
CPC Code
H01L 21/6835
H01L 21/76898
H01L 23/5226
H01L 33/52
H01L 2933/005
H01L 51/003
H01L 21/68
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