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US Patent 11282760 Integrated packaging devices and methods with backside interconnections

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
Current Assignee
‌
Obsidian Sensors, Inc.
Date Filed
October 22, 2019
Date of Patent
March 22, 2022
Patent Applicant
‌
Obsidian Sensors, Inc.
Patent Application Number
16660664
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11282760
Patent Primary Examiner
‌
Fernando L Toledo
CPC Code
‌
H01L 21/6835
‌
H01L 21/76898
‌
H01L 23/5226
‌
H01L 33/52
‌
H01L 2933/005
‌
H01L 51/003
‌
H01L 21/68

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