Patent attributes
Heat dissipation device for an electronic board comprising a support body connected to the electronic board, said electronic board being provided with an electric connection interface which can be inserted into/extracted from an electric connector provided in a direction orthogonal with respect to the lying plane of a support plate, having a heat dissipation surface configured to dissipate the heat transmitted to it by thermal conduction, wherein said heat dissipation device comprises at least one holding element and a leveling member, coordinated with respect to each other in order to position a surface of the support body in contact with the heat dissipation surface of the support plate.