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US Patent 11274369 Thin film deposition method
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Patent
Date Filed
September 9, 2019
Date of Patent
March 15, 2022
Patent Application Number
16565460
Patent Citations
US Patent 10590531 Substrate processing apparatus, and method of manufacturing semiconductor device
US Patent 10622236 Apparatus and method for handling wafer carrier doors
US Patent 10648788 Substrate distance monitoring
US Patent 10662525 Thin film deposition apparatus
US Patent 10704143 Oxide film forming method
US Patent 10714335 Method of depositing thin film and method of manufacturing semiconductor device
US Patent 10731249 Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a reaction chamber, and related vapor deposition apparatus
US Patent 10734497 Methods for forming a semiconductor device structure and related semiconductor device structures
US Patent 10741386 Deposition of SiN
US Patent 10763139 Vacuum transfer module and substrate processing apparatus
•••
Patent Citations Received
US Patent 11758641 Power supply system for improving plasma uniformity and method thereof
US Patent 11610764 Plasma source and method of operating the same
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11274369
Patent Primary Examiner
Katherine A. Bareford
CPC Code
C23C 16/45536
H01J 2237/3321
H01J 37/32724
H01J 37/32568
H01J 37/32174
H01L 21/02274
C23C 16/4586
H01L 21/0228
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