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US Patent 11268191 Atomic layer polishing method and device therefor
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Is a
Patent
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Date Filed
November 1, 2018
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Date of Patent
March 8, 2022
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Patent Application Number
16644440
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Patent Citations
US Patent 10096487 Atomic layer etching of tungsten and other metals
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Patent Inventor Names
Seung Ryul Yoo
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Kang Il Lee
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Yong Sup Choi
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Soo Ouk Jang
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Dong Chan Seok
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Jong Sik Kim
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11268191
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Patent Primary Examiner
Shamim Ahmed
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