US Patent 11227821 Chip-on-chip power card with embedded thermal conductor
Patent 11227821 was granted and assigned to Toyota Motor Engineering & Manufacturing North America on January, 2022 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
April 21, 2020
Date of Patent
January 18, 2022
Patent Applicant
Patent Application Number
16854748
Patent Citations Received
Patent Inventor Names
Feng Zhou
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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