US Patent 11217979 Sealing device for feeding through filaments
Patent 11217979 was granted and assigned to Commscope Connectivity Belgium BV on January, 2022 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
February 20, 2020
0
Date of Patent
January 4, 2022
0
Patent Applicant
Patent Application Number
16796233
0
Patent Citations Received
Patent Inventor Names
Bart Mattie Claessens
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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