Patent 11189341 was granted and assigned to Taiwan Semiconductor Manufacturing Company on November, 2021 by the United States Patent and Trademark Office.
A memory device includes a plurality of memory cells arranged in an array having a plurality of rows and a plurality of columns. A first word line is connected to a first plurality of the memory cells of a first row of the array, and a second word line is connected to a second plurality of the memory cells of the first row of the array. In some examples, the plurality of memory cells are arranged in or on a substrate, and the first word line is formed in a first layer of the substrate and the second word line is formed in a second layer of the substrate.