Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yasuhiro Suzuki0
Date of Patent
November 30, 2021
0Patent Application Number
164744090
Date Filed
March 15, 2017
0Patent Primary Examiner
Patent abstract
A heat pump apparatus includes: a refrigerant circuit which circulates refrigerant; a heat medium circuit which makes a heat medium flow; a heat exchanger which cause heat exchange to be performed between the refrigerant and the heat medium; and an indoor unit which houses at least the heat exchanger. The heat exchanger has a double-wall structure. The indoor unit includes a container which houses the heat exchanger. In the container, a first opening port is formed to communicate with an outdoor space without communicating with an indoor space.
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