US Patent 11183492 Multilevel template assisted wafer bonding
Patent 11183492 was granted and assigned to Skorpios Technologies on November, 2021 by the United States Patent and Trademark Office.
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Patent abstract
Fabricating a multilevel composite semiconductor structure includes providing a first substrate comprising a first material; dicing a second substrate to provide a plurality of dies; mounting the plurality of dies on a third substrate; joining the first substrate and the third substrate to form a composite structure; and joining a fourth substrate and the composite structure.
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
111834920
Date of Patent
November 23, 2021
0Patent Application Number
159005900
Date Filed
February 20, 2018
0Official Website
Patent Primary Examiner
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Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
111834920
Date of Patent
November 23, 2021
0Patent Application Number
159005900
Date Filed
February 20, 2018
0Official Website
Patent Primary Examiner
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US Patent 11183492 Multilevel template assisted wafer bonding
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11183492
Date of patent
November 23, 2021
Patent application number
15900590
Date Filed
February 20, 2018
Patent primary examiner
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