US Patent 11183436 Power module package and packaging techniques
Patent 11183436 was granted and assigned to Allegro Microsystems, Llc on November, 2021 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
January 17, 2020
0
Date of Patent
November 23, 2021
0
Patent Applicant
Patent Application Number
16746275
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Patent Inventor Names
Shixi Louis Liu
0
Natasha Healey
0
Rishikesh Nikam
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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