Patent attributes
Various embodiments may provide a semiconductor package. The semiconductor package may include a substrate including a via hole. The semiconductor package may also include a chip attached to the substrate. The semiconductor package may further include a prefabricated ferromagnetic pin having a first portion held by the via hole, a second portion extending from a first end of the first portion, and a third portion extending from a second end of the first portion opposite the first end. The semiconductor package may also include a first magnetic shield structure attached to or extended from the second portion of the prefabricated ferromagnetic pin. The semiconductor package may further include a second magnetic shield structure attached to or extended from the third portion of the prefabricated ferromagnetic pin, such that at least a portion of the chip is between the first magnetic shield structure and the second magnetic shield structure.
