US Patent 11177197 Semiconductor package with solder standoff
Patent 11177197 was granted and assigned to Texas Instruments on November, 2021 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
September 25, 2019
0
Date of Patent
November 16, 2021
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Patent Applicant
Patent Application Number
16581971
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Patent Inventor Names
Lance Cole Wright
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Jonathan Almeria Noquil
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Osvaldo Jorge Lopez
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Satyendra Singh Chauhan
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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