Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
November 16, 2021
Patent Application Number
16755934
Date Filed
October 25, 2018
Patent Citations Received
Patent Primary Examiner
Patent abstract
A bonded body is formed by bonding a ceramic member formed of an Al-based ceramic and a copper member formed of copper or a copper alloy, in which, in a bonding layer formed between the ceramic member and the copper member, a crystalline active metal compound layer formed of a compound including an active metal is formed on a ceramic member side, and, the Al concentration is 0.15 at % or less in a thickness range of 0.5 μm to 3 μm from an interface of the active metal compound layer on a copper member side toward the copper member.
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