Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Xiaoju Yu1
Bin Yang1
Kai Liu1
Xia Li1
Date of Patent
November 16, 2021
1Patent Application Number
168352271
Date Filed
March 30, 2020
1Patent Primary Examiner
Patent abstract
Examples herein include thermally conductive pathways for glass substrates such as used by passive on glass devices that may be used to enhance the thermal conductivity of an integrated POG device. By using a thermally conductive material for passivation of the device pathways during manufacturing, the device pathways may be able to conduct heat away from the device. For example, by using a selected poly (p-phenylene benzobisoxazole) (PBO) based material (e.g., poly-p-phenylene-2, 6-benzobisoxazole) instead of conventional polyimide (PI) materials during a Cu pattern passivation process, the overall thermal performance of the device, may be enhanced.
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