Patent attributes
A thermoforming device includes: an upper hot plate including a first heating surface configured to heat a sheet from above; a lower hot plate including a second heating surface configured to heat the sheet from below; and a substrate-supplying unit including a base configured to hold a molded substrate, and configured to attach the molded substrate to and detach the molded substrate from the base and to dispose the molded substrate at a molding position below the first heating surface with the sheet interposed therebetween, in which the upper hot plate and the lower hot plate are configured to heat the sheet simultaneously from an upper surface and a lower surface of the sheet, the lower hot plate is provided to be movable in a horizontal direction with respect to a position below the upper hot plate, and the thermoforming device die-molds or adheres, onto the molded substrate held by the base, the sheet softened by being heated by the upper hot plate and the lower hot plate.
