US Patent 11173314 Implantable lead

The present disclosure relates to an implantable lead comprising an elongated lead body having at least one lumen therein and at least one through hole, and at least one electrically conductive wire. For at least one of said at least one lumen, a first through hole extends from an outer surface of the lead body into said lumen, and an electrically conductive wire is arranged in said lumen at least on one side of said first through hole. Furthermore, said electrically conductive wire is further arranged in a configuration exiting the lumen via said first through hole and wound around a predefined portion of the outer surface of the lead body.