US Patent 11171056 Wafer processing method

A cutting method includes: disposing a dicing tape on a back surface of a wafer; holding the wafer on a chuck table through the dicing tape; causing a cutting blade to cut into the wafer held on the chuck table until the tip of the cutting blade reaches the dicing tape to form cut grooves; imaging the cut groove from the front surface side of the wafer by a first imaging section to form a picked-up image of a front surface portion of the cut groove, and imaging the cut groove from the front surface side of the wafer by a second imaging section to form a picked-up image of a back surface portion of the cut groove, thereby checking the picked-up images of the front surface portion and the back surface portion of the cut groove.