US Patent 11166387 Wiring board and manufacturing method thereof
Patent 11166387 was granted and assigned to Unimicron Technology on November, 2021 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
April 14, 2020
Date of Patent
November 2, 2021
Patent Applicant
Patent Application Number
20200414
Patent Jurisdiction
Patent Number
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