Log in
Enquire now
‌

US Patent 11160692 Method and apparatus for manufacturing absorbent article

Patent 11160692 was granted and assigned to Zuiko on November, 2021 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors

Contents

Is a
Patent
Patent
0

Patent attributes

Patent Applicant
‌
Zuiko
0
Current Assignee
‌
Zuiko
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
111606920
Patent Inventor Names
Daisuke Inoue0
Kouji Utani0
Date of Patent
November 2, 2021
0
Patent Application Number
201709210
Date Filed
September 21, 2017
0
Patent Citations Received
‌
US Patent D1009256 Absorbent core
0
‌
US Patent D984379 Electronics module housing
0
‌
US Patent D988265 Electronics module housing
0
Patent abstract

An apparatus for manufacturing an article including an absorbent body includes: first and second rolls, in cooperation with each other, for trimming a continuous laminate to be the absorbent body so as to successively form the narrowed portions along the continuous laminate; a third roll for rotating in contact with the second roll to receive the continuous laminate from the second roll; and a separating cutter for successively severing the continuous laminate being carried by the third roll into units of individual articles, thereby obtaining the absorbent body.

Timeline

No Timeline data yet.

Further Resources

Title
Author
Link
Type
Date
No Further Resources data yet.

References

Find more entities like US Patent 11160692 Method and apparatus for manufacturing absorbent article

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo

Company

  • Home
  • Press & Media
  • Blog
  • Careers
  • WE'RE HIRING

Products

  • Knowledge Graph
  • Query Tool
  • Data Requests
  • Knowledge Storage
  • API
  • Pricing
  • Enterprise
  • ChatGPT Plugin

Legal

  • Terms of Service
  • Enterprise Terms of Service
  • Privacy Policy

Help

  • Help center
  • API Documentation
  • Contact Us
By using this site, you agree to our Terms of Service.