Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yoshitaka Taniguchi0
Hideki Hirotsuru0
Kohki Ichikawa0
Atsushi Sakai0
Date of Patent
August 17, 2021
0Patent Application Number
201807300
Date Filed
July 30, 2018
0Patent abstract
A ceramic circuit board includes a ceramic substrate and metal layers provided to both surfaces of the ceramic substrate and containing Al and/or Cu, wherein a measurement value α1 of a linear thermal expansion coefficient at 25° C. to 150° C. is 5×10−6 to 9×10−6/K, a ratio α1/α2 of the α1 to a theoretical value α2 of the linear thermal expansion coefficient at 25° C. to 150° C. is 0.7 to 0.95, and at least one of the metal layers forms a metal circuit.
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